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alistairxf

Alistair Finch

@alistairxf

PCB Design and Hardware Systems Engineer

United Kingdom
English, German, French, Spanish, Italian
About me
Senior Electronics Engineer with over 7 years of specialized experience in complex hardware design. I translate intricate schematics into production-ready, highly optimized board layouts strictly adhering to DFM, EMI/EMC, and safety standards. Advanced capabilities: ● Multi-layer high speed PCB ● Signal integrity analysis ● Impedance control ● High-speed interfaces (USB, HDMI, Ethernet) ● Power electronics ● BMS ● SMPS & Buck/Boost DC-DC converters. Expert user of Altium Designer and Cadence Allegro. Please message me to discuss your technical specifications before ordering.... Read more

Skills

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alistairxf
Alistair Finch
Offline • 
Average response time: 1 hour

See my services

Printed Circuit Boards (PCB)
I will do smps pcb design, buck boost converter, power supply pcb, charger circuit
Printed Circuit Boards (PCB)
I will design automation pcb, robotics, digital iot and automotive pcb design in kicad

Work experience

LinkedIn

PCB Design & Hardware Systems Engineer

LinkedIn • Self-employed

Feb 2019 - Present7 yrs 6 mos

Delivered end-to-end electronic hardware design, schematic capture, and advanced multi-layer PCB layout engineering for international clients, ensuring strict compliance with high-speed signal integrity and industrial manufacturing standards. Key Technical Responsibilities & Achievements: • High-Speed Layout & Signal Integrity: Engineered multi-layer PCBs with strict impedance control for high-speed communication interfaces, including USB, HDMI, and Gigabit Ethernet systems using Altium Designer and Cadence Allegro. • Power Electronics & Management: Designed robust power electronics architectures, including highly efficient Battery Management Systems (BMS), switching power supplies (SMPS), and optimized Buck-Boost DC-DC converters. • DFMA Optimization: Conducted rigorous Design for Manufacturing (DFM) and Design for Assembly (DFA) reviews, eliminating production bottlenecks and reducing fabrication failure rates to zero for high-yield runs. • Signal & Power Integrity (SI/PI): Executed detailed layout optimizations to counter EMI/EMC issues, minimize crosstalk, and ensure clean power distribution networks across complex board stack-ups.