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I will design multilayer hdi pcb with bga fanout and stackup engineering
PCB Design and Embedded System
HELLO AND WELCOME!!
I'm Jonathan Stewart, a professional PCB design and embedded systems engineering services for custom electronics, IoT products, industrial devices, and embedded hardware applicatio...
About this Gig
HELLO AND WELCOME TO MY GIG!!!!
Advanced electronic products require compact layouts, reliable BGA escape routing, and carefully engineered PCB stackups. I provide professional multilayer HDI PCB design, fine-pitch BGA fanout, microvia planning, and high-density routing for complex electronic hardware
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WHAT I OFFER,
- Multilayer HDI PCB Design & Layout
- Fine-Pitch BGA Fanout & Escape Routing
- Blind, Buried & Microvia Planning
- Via-in-Pad Design Support
- Controlled Impedance Stackup Planning
- Power and Ground Plane Optimization
- Signal Integrity-Aware Layout
- DRC, DFM & Manufacturing Review
- Gerber, Drill, BOM & Pick-and-Place Files
WHY CHOOSE ME?
- Detail-focused high-density PCB layout
- Organized BGA escape and routing strategy
- Careful stackup and via planning
- Manufacturing-focused design practices
- Clear communication and tailored solutions
Whether you need a compact HDI board, fine-pitch BGA breakout, or a complex multilayer PCB, I tailor the layout to your component datasheets, electrical requirements, fabrication capabilities, and design constraints.
Kindly provide your schematic, component datasheets, BGA package details, board dimens
FAQ
What is an HDI PCB?
HDI (High-Density Interconnect) PCB technology uses fine traces, small vias, and dense component routing to support compact, complex electronic designs.
Can you design fine-pitch BGA fanout?
Yes, for supported packages and project complexity. Provide the BGA footprint, pitch, pin map, escape requirements, and fabrication rules.
Do you support microvias and blind or buried vias?
Via structures can be planned according to the selected fabrication process and manufacturer's capabilities.
Can you create a multilayer PCB stackup?
Yes. Stackup planning can account for layer count, copper distribution, dielectric materials, routing density, grounding, and impedance requirements.
Do you support Altium Designer and KiCad?
I can support projects in the PCB design software I work with. Kindly confirm your preferred tool before ordering.
