I will do motor control pcb, power distribution, power conversion, power elctronics pcb
Power Electronics and PCB Layout Specialist
About this Gig
I am an electronics hardware engineer with 7+ years experience specializing in high-current power electronics, motor control pcb setups, power distribution, power conversion. I turn schematics into production-ready boards for high power density and tight thermal limits.
Services I Offer:
- High-current motor control pcb design (BLDC, PMSM, stepper, brushed DC)
- Power conversion systems (buck, boost, flyback, inverter, PFC stages)
- Power distribution architecture, busbars, heavy copper polygon pours
- Gate driver design, MOSFET, IGBT, GaN, SiC switching setups
- Thermal management, copper stackups, thermal vias, heatsink footprints
- High-voltage isolation, clearance, creepage compliance (IEC/UL)
Tools I Use:
- Altium Designer, KiCad, Saturn PCB Toolkit, SolidWorks
File Formats Delivered:
- Gerber RS-274X/X2, NC Drill, ODB++
- Schematic PDF, BOM (Mouser, DigiKey, LCSC)
- Pick & Place CPL, 3D STEP Model
Why Work With Me?
- Trace width & copper weight calculations
- Thermal-aware placement & efficient heat distribution
- DFM & DFA verified for factory assembly
- Unlimited Revisions
Please message me to discuss your project requirements before placing a direct order.
FAQ
What details do I need to supply before we begin the layout?
You should provide your schematic file or circuit requirements, input/output voltage and current limits, expected switching frequency, board dimensions, and target enclosure constraints. If you do not have a finished schematic, I can assist in drafting one based on your specifications.
How do you handle high current routing on a power pcb?
High current traces are sized using IPC-2221 standards, considering thermal rise and copper weight (1oz, 2oz, or heavier). I utilize wide copper pours, busbar connections, unmasked areas for solder filling, and multi-layer copper stitching to keep resistance and heat to a minimum.
How do you manage heat dissipation on motor control and power conversion boards?
Thermal management is integrated directly into the layout. I place thermal via arrays underneath switching MOSFETs or ICs, optimize copper ground pours to spread heat across layers, and align high-power components to allow proper airflow or heatsink mounting.
Do you ensure proper creepage and clearance distances for high voltage?
Yes. High-voltage power electronics and motor control boards require strict adherence to creepage and clearance limits to avoid arcing. I apply design rules based on IEC standards to separate high-voltage nodes from low-voltage control circuitry, including isolation slots where needed.

