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Wendi K
@packagingeng_id
Level 1
Industrial Packaging Structural Engineer, ArtiosCAD Dieline Specialist
Indonesia
English, Indonesian
About me
Structural Packaging Engineer with 12+ years at two global leaders: Asia
Pulp & Paper (APP) and Tri-Wall (Japan).
I create precise, manufacturing-ready dielines using ArtiosCAD. Whether
standard RSC boxes, complex mailers, or heavy-duty industrial packaging,
I engineer solutions ready for immediate production.
Deep expertise: Material properties (E-flute, B-flute, Triple Wall),
structural integrity, cost optimization, and international compliance
(FEFCO/ECMA).
Your packaging isn't just design—it's engineered for factory success. Fast turnaround.
Message me your specifications.
Skills

Wendi K
Offline •
Average response time: 5 hours
See my services

Dieline Design
I will create professional artioscad dielines and 3d packaging
4 Reviews
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Rating Breakdown
- Seller communication level
- Quality of delivery
- Value of delivery
1-4 out of 4 Reviews
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kimscopelliti

United States
Wendi really understood what I was looking for in packaging and went the extra mile to deliver a very professional design that met my goals. I look forward to working with him again in the near future. Thank you, Wendi!
Helpful?
shivismagee

United Kingdom
Seller's Response
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mofado77
Repeat Client

Canada
Helpful?
anasumardi

Indonesia
Perfect dieline for products with minimal height. Efficient and cost-effective.
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