I will design multilayer high speed pcb for ai accelerators and edge computing systems

If you are working on AI accelerators or edge computing hardware, you already know that standard layout rules don't apply here. When you are dealing with lightning-fast clock speeds and massive transient currents, a minor routing oversight means your board simply won't boot. I specialize in complex, high-density multilayer layouts (from 4 up to 20+ layers) designed to handle the heavy lifting required by modern AI SoCs, NPUs, and FPGAs. I map out your board to ensure it actually performs under load.

What I focus on during the layout: 

• Memory Routing: Precise length matching and phase tuning for DDR4/DDR5 to protect timing margins.
• High-Speed Buses: Controlled impedance routing for PCIe Gen5 and USB 4.0.
• Power & Thermal: Sub-BGA decoupling to prevent voltage drops, paired with smart copper planning for heat dissipation.

How we get started: Just send over your finalized schematic (Altium, KiCad, or OrCAD), your mechanical constraints (STEP/DXF), and any specific rules your preferred board house requires. Every design includes a detailed 1015 page DFM Optimization Report. Its a manual engineering review covering your stackup, via compliance, and drill clearances.