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I will design class d bluetooth speaker hardware
About this Gig
Looking for a clean, powerful, and efficient audio amplifier design? I specialize in high-efficiency Class-D amplifier boards and custom wireless Bluetooth/Wi-Fi speaker hardware.
I design robust circuit paths that prevent electromagnetic interference (EMI) and safely manage thermal dissipation.
What I Do:
Premium Chipset Integration: TI TPA-series, Infineon MERUS, STMicroelectronics, and Analog Devices.
Thermal Management: Exposed pad soldering layouts, heavy copper pours, and via stitching for heat sinking.
LC Filter Optimization: Precision output stage design for lowest Total Harmonic Distortion (THD+N).
Wireless Audio: Integration of Bluetooth (A2DP, aptX, LE Audio) and Wi-Fi streaming architectures.
Deliverables: Production-ready Gerbers, assembly prints, thermal dissipation guidelines, and global sourcing BOM.
Specialization:
Circuit design
•
Layout
•
Simulations
File format:
Gerber
•
STEP
•
SCH
•
•
Pcbdoc
Software:
Altium Designer
•
KiCad
•
LTspice
Interface:
I2S
•
I2C
•
Wi-Fi
FAQ
Can you integrate Bluetooth chips directly onto the same audio board without causing audio hum?
Yes. I isolate the sensitive Bluetooth RF circuit block and its antenna away from the high-current amplifier switching nodes, utilizing split ground return paths joined only at a single star-ground point to avoid ground loops and low-frequency noise hum.
How do you prevent electromagnetic interference (EMI) from failing FCC or CE compliance?
Class-D amplifiers are high-frequency switching circuits that generate EMI. I suppress this by placing compact, low-ESR LC filters right at the amplifier output terminals, using shielded inductors, and surrounding the switching node with solid ground shield planes.
