I will design a high speed pcb

This gig is ideal for products requiring High-Speed Digital Interfaces, complex BGA/LGA routing, controlled impedance, and precise signal timing. Every PCB is designed with careful attention to Signal Integrity (SI), Power Integrity (PI), EMI/EMC compliance, thermal performance, and Design for Manufacturing (DFM) to ensure smooth fabrication and assembly.

What I Offer:

• High-Speed PCB Layout
• Schematic Capture
• 2 to 32 Layer PCB
• Multi-Layer Stack-up Planning
• Controlled Impedance PCB
• Differential Pair Routing
• Length Matching and Timing Optimisation
• Signal Integrity and Power Integrity Considerations
• BGA, LGA, QFN, QFP, CSP, and Fine-Pitch Component Fan-Out
• HDI PCB Design with Blind and Buried Vias
• Via-in-Pad and Microvia Routing
• DDR3, DDR4, DDR5 and LPDDR Memory Routing
• PCIe Gen3, Gen4 and Gen5 PCB
• USB 2.0, USB 3.2 and USB Type-C
• HDMI, DisplayPort, Ethernet, MIPI CSI/DSI and SATA
• FPGA and High-Speed Processor PCB Layout
• RF and Mixed-Signal PCB
• Power Supply and DC-DC Converter Layout
• Design Rule Check (DRC)
• Design for Manufacturing (DFM)
• Design for Assembly (DFA)
• Component Placement Optimisation
• Thermal Management & Copper Balance